With full intellectual property rights of femtosecond laser direct writing 3D photonic chip and advanced technology of designing and processing photonic chip at home and abroad, it can realize independent design, preparation and packaging with small iteration cycle.
In the field of optical interconnection, 3D photonic chip can be processed according to customer requirements for drawings, and can provide highly accurate chip packaging process, providing from chip design, chip preparation, chip testing, chip packaging, chip with low loss, high precision and excellent stability, etc., the number of waveguide cores can be up to 64 cores
Core Technical Indicators
1：Chip loss:<- 1dB 2：Chip insertion loss:<-0.7dB 3：Package insertion loss:<-1.7dB 4：Crosstalk:<-50dB 5：Waveguide centre deviation:±50nm
Fan-in, fan-out multicore 3D photonic chip：fiber-to-multicore fiber coupling solution, space division multiplexing for optical communications, capable of being used in data centres, submarine cables and terrestrial cables